Terafab reportedly targets 1 million wafers a month after 2032
Tesla and SpaceX's chip venture is pressing toolmakers now, though its memory partner and technology remain undisclosed.
Tesla and SpaceX's Terafab reportedly told equipment suppliers it is aiming for 1 million wafers a month after 2032, with roughly 700,000 earmarked for memory and over 300,000 for logic. The memory share would be comparable to Samsung's estimated DRAM output, though the comparison is imperfect because Terafab's figure covers any memory type while the Samsung and SK hynix numbers cover DRAM only. Procurement staff have already visited Japanese toolmakers and asked for some deliveries within months, and the company is reportedly working with Intel on 2nm and 1.4nm logic processes. The memory technology and partner remain undisclosed, and Musk has himself described the schedule as very aggressive, with volume production targeted for the second half of 2028 and a first phase costing $16.8 billion in Grimes County, Texas.
Why it matters
If the plan holds, Terafab would become a major new source of chip capacity, with its memory share rivalling Samsung's estimated DRAM output. The figures are still informal and the timeline is one Musk himself calls very aggressive, so the scale of the bet is clear but its outcome is not. For readers following the semiconductor supply chain, the question is whether a first phase budgeted at $16.8 billion in Texas can convert early equipment orders into production on the stated 2028 schedule.
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