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Last updated 3 October 2026 Search Türkçe
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Infrastructure

Amazon and Synopsys sign a multi-year deal to speed AI chip design

The agreement deepens the link between chip design tools and AWS infrastructure as both companies push more of their work into the same stack.

Amazon and Synopsys have struck a multi-year partnership, reportedly worth more than $1 billion, to speed up AI chip design and tighten the fit between their tools and infrastructure. Amazon will expand its use of Synopsys IP and EDA software for custom silicon work, including AI chips and AWS hardware, while Synopsys will tune its multiphysics stack for Amazon’s Trainium and Graviton chips. The agreement also has Synopsys moving more of its own development onto AWS and using Amazon Bedrock for AI applications and agents. For companies building chips or cloud infrastructure, the deal signals deeper automation in design workflows and a closer link between chip IP, cloud services, and agentic AI.

Why it matters

For teams building custom chips and the cloud systems around them, the deal points to faster design cycles and tighter coordination between software tools, chip IP and infrastructure. Amazon gets broader use of Synopsys technology for its AI chip and hardware work, while Synopsys aligns its own tools and development with AWS and Bedrock, which should make the two companies’ platforms more intertwined going forward.

Sources

  • Tom's Hardware