GlobalFoundries to make TSMC CoWoS interposers in the US under $2 billion deal
The agreement gives TSMC a domestic source for a key advanced-packaging part and sets up production to begin in 2028.
GlobalFoundries and TSMC have signed a five-year, $2 billion manufacturing deal that brings production of silicon interposers for TSMC’s CoWoS packaging into the U.S. This matters for chip builders because interposers are a key advanced-packaging component for AI and HPC parts, and the arrangement gives TSMC a domestic source for parts that can support “made and packaged in America” systems. GlobalFoundries will expand its Malta, New York, site for the work, with volume production expected in the first half of 2028. The move fits into TSMC’s wider U.S. packaging push in Arizona, alongside its 10-year deal with Amkor and plans to add CoWoS and 3D-IC capabilities before 2029.
Why it matters
For chip makers, this adds a US source for silicon interposers used in CoWoS packaging, which are part of the supply chain for AI and HPC systems. It also ties GlobalFoundries’ Malta site into TSMC’s broader US packaging buildout, with volume production due in the first half of 2028 and more CoWoS and 3D-IC capacity planned in Arizona before 2029.
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Sources
- Tom's Hardware